DocID023348 Rev 7

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M34E04

Package mechanical data

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8

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 14. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat no lead,

package outline

1. Drawing is not to scale.

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 14. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data

Symbol

millimeters

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

A

0.550

0.450

0.600

0.0217

0.0177

0.0236

A1

0.020

0.000

0.050

0.0008

0.0000

0.0020

b

0.250

0.200

0.300

0.0098

0.0079

0.0118

D

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MC)

-

1.200

1.600

-

0.0472

0.0630

E

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MC)

-

1.200

1.600

-

0.0472

0.0630

e

0.500

-

-

0.0197

-

-

K (rev MC)

-

0.300

-

-

0.0118

-

L

-

0.300

0.500

-

0.0118

0.0197

L1

-

-

0.150

-

-

0.0059

L3

-

0.300

-

-

0.0118

-

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

-

0.080

-

-

0.0031

-