PCF5079 datasheet(2/28 Pages) PHILIPS

2 / 28 page

2001 Nov 21

Philips Semiconductors

Product speciﬁcation

Dual-band power ampliﬁer controller for

GSM, PCN and DCS

PCF5079

CONTENTS

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

QUICK REFERENCE DATA

BLOCK DIAGRAM

PINNING

6.1

Pin description

6.2

Pin configurations

FUNCTIONAL DESCRIPTION

7.1

General

7.2

Power-up mode

7.3

OP4 (integrator)

7.4

Start-up and initial conditions

7.5

Home position voltage

7.6

End of burst

7.7

Considerations for ramp-down

7.8

Configurations

7.9

Summary of current and voltage definitions

7.10

Timing

LIMITING VALUES

ELECTROSTATIC DISCHARGE (ESD)

DC CHARACTERISTICS

OPERATING CHARACTERISTICS

APPLICATION INFORMATION

12.1

Ramp control

12.2

PA protection against mismatch

12.3

Detected voltage measurement

12.4

Application examples

PACKAGE OUTLINES

SOLDERING (TSSOP10)

14.1

Introduction to soldering surface mount

packages

14.2

Reflow soldering

14.3

Wave soldering

14.4

Manual soldering

14.5

Suitability of surface mount IC packages for

wave and reflow soldering methods

SOLDERING (HVSON10)

15.1

Soldering information

15.2

PCB design guidelines

15.2.1

Perimeter pad design

15.2.2

Thermal pad and via design

15.2.3

Stencil design for perimeter pads

15.2.4

Stencil design for thermal pads

15.2.5

Stencil thickness

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

PCF5079 Datasheet(PDF) 2 Page - NXP Semiconductors

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