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BGF844 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BGF844
Description  GSM800 EDGE power module
PDF  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BGF844 Datasheet(HTML) 2 Page - NXP Semiconductors

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2003 Jun 06
2
Philips Semiconductors
Product specification
GSM800 EDGE power module
BGF844
FEATURES
• Typical GSM EDGE performance at a supply voltage of
26 V:
– Output power = 2.5 W
– Gain = 30 dB
– Efficiency = 16%
– ACPR <
−65 dBc at 400 kHz
– rms EVM < 0.4%
– peak EVM < 1.2%
• Low distortion to a GSM EDGE signal
• Excellent 2-tone performance
• Low die temperature due to copper flange
• Integrated temperature compensated bias
• 50 Ω input/output impedance
• Flat gain over frequency band.
APPLICATIONS
• Base station RF power amplifiers in the 869 to 894 MHz
frequency range
• GSM, GSM EDGE, multi carrier applications
• Macrocell (driver stage) and Microcell (final stage).
DESCRIPTION
23 W LDMOS power amplifier module for base station
amplifier applications in the 869 to 894 MHz band.
PINNING - SOT365C
PIN
DESCRIPTION
1
RF input
2VS
3
RF output
Flange
ground
23
1
Top view
MBL257
Fig.1 Simplified outline.
QUICK REFERENCE DATA
Typical RF performance at Tmb =25 °C.
Note
1. ACPR 400 kHz at 30 kHz resolution bandwidth.
MODE OF OPERATION
f
(MHz)
VS
(V)
PL
(W)
Gp
(dB)
η
(%)
ACPR
(dBc)
rms EVM
(%)
CW
869 to 894
26
23
29
50
−−
GSM EDGE
869 to 894
26
2.5
30
16
−65(1)
0.4



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