2. Hardware Design

2.1. What performance can be achieved?

A typical example of an application is a very small 3D TOF camera (refer to Figure 20).

epc610 chip

with IR filter on top

Illumination LEDs

Figure 18: Low power, high performance 3D TOF imager

Size: 32 x 22 x 25 mm

Figure 19: Chip on PCB board

In this example, a range of up to 2.4m can be expected on white targets when using: two SFH4059 LEDs directly driven by the LED pin, a

The maximum measurement cycle time in this application is:

t

(refer to chapter 3.5.9. Cycle time calculation).

LED

NC1

NC2

VREF

VDDIO

VDDHPX

VDDPX

VDDCP

VDDBS

XTAL1

XTAL2

VDDT

VDDM

VDDPLL

VDDCORE

GNDLED

GNDPLL

GNDA

GND

VDD

epc610

2

3

4

5

6

7

8

9

10

11

12

13

14

17

21

22

23

24

VDD +8.5V

D1

BAS40

C9

C8

C7

C6

C5

C4

C3

10n

100n

1μ

4μ7

4μ7

4μ7

1μ

LED1

SFH4059

LED2

SFH4059

R2

4k7

R1

27R

C12

100n

GND

Low Z, fast switching connection (as short and wide conductors as possible)

15

16

C11

18p

C10

18p

Y1

4MHz

C2

1μ

C1

10μ

GND

+

D1A

BAV99

D1B

BAV99

VDDBS -5.0V

nSS

SCLK

MOSI

MISO

1

18

19

20

nSS

SCLK

MOSI

MISO

R3

0R

Figure 20: Minimum part count application

© 2014 ESPROS Photonics Corporation

Characteristics subject to change without notice

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Datasheet epc610 - V1.7

www.espros.ch