TC1300 datasheet(4/16 Pages) MICROCHIP

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TC1300

DS21385C-page 4

 2002 Microchip Technology Inc.

RESET Output

Voltage Range

VDET

1.0

1.2

—

6.0

VTA = 0°C to +70°C

TA = – 40°C to +125°C

Reset Threshold

VTH

2.59

2.63

2.66

TC1300R-XX, TA = +25°C

2.55

—

2.70

TC1300R-XX,

TA = – 40°C to +125°C

2.36

2.40

2.43

TC1300Y-XX, TA = +25°C

2.32

—

2.47

TC1300Y-XX,

TA = – 40°C to +125°C

Reset Threshold Tempco

∆VTH / ∆T

—

ppm/°C

VDET to Reset Delay

tRPD

—160

—

µsec

VDET = VTH to (VTH – 100 mV)

Reset Active Timeout Period

tRPU

140

300

560

msec

RESET Output Voltage Low

VOL

——0.3

VDET = VTH min,

ISINK = 1.2 mA

RESET Output Voltage High

VOH

0.8 VDET

——

VDET > VTH max,

ISOURCE = 500 µA

ELECTRICAL CHARACTERISTICS (CONTINUED)

VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply

for junction temperature (Note 8) of -40°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1: VR is the regulator output voltage setting.

3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value

measured at a 1V differential.

5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,

excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-

perature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissi-

pation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data

sheet for more details.

7: The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ (VR + VDROPOUT).

8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature

equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature

over the ambient temperature is not significant.

TCVOUT

VOUTMAX VOUTMIN

–

() 10

VOUT

∆

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