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TC1300 Datasheet(PDF) 9 Page - Microchip Technology

Part # TC1300
Description  300 mA CMOS LDO with Shutdown, Bypass and Independent Delayed Reset Function
PDF  16 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

TC1300 Datasheet(HTML) 9 Page - Microchip Technology

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 2002 Microchip Technology Inc.
DS21385C-page 9
TC1300
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the regula-
tor off when the die temperature exceeds 150°C. The
regulator remains off until the die temperature drops to
approximately 140°C.
4.2
Power Dissipation
The amount of power the regulator dissipates is prima-
rily a function of input and output voltage, and output
current. The following equation is used to calculate
worst case actual power dissipation:
EQUATION
The maximum allowable power dissipation, PDMAX, is a
function of the maximum ambient temperature (TAMAX),
the maximum recommended die temperature (125°C)
and the thermal resistance from junction-to-air (
θJA).
The MSOP-8 package has a
θJA of approximately
200°C/Watt when mounted on a FR4 dielectric copper
clad PC board.
EQUATION
The worst case actual power dissipation equation can
be used in conjunction with the LDO maximum allow-
able power dissipation equation to ensure regulator
thermal operation is within limits. For example:
Find:
EQUATION:
ACTUAL POWER
DISSIPATION
EQUATION:
MAXIMUM ALLOWABLE
POWER DISSIPATION
In this example, the TC1300 dissipates a maximum of
only 220 mW; below the allowable limit of 350 mW. In a
similar manner, the maximum actual power dissipation
equation and the maximum allowable power dissipa-
tion equation can be used to calculate maximum cur-
rent and/or input voltage limits. For example, the
maximum allowable VIN is found by substituting the
maximum allowable power dissipation of 350 mW into
the actual power dissipation equation, from which
VINMAX = 4.97V.
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads and wide power
supply bus lines combine to lower
θJA and, therefore,
increase the maximum allowable power dissipation
limit.
PD
VINMAX VOUTMIN
–
()ILOADMAX
≈
Where:
PD = worst case actual power dissipation
VINMAX = maximum voltage on VIN
VOUTMIN = minimum regulator output voltage
ILOADMAX = maximum output (load) current
PDMAX
TJMAX TAMAX
–
()
θJA
--------------------------------------------
=
Given:
VINMAX
=4.1V
VOUTMIN
= 3.0V -2.5%
ILOADMAX =200 mA
TJMAX
= 125°C
TAMAX
=55°C
θJA
= 200°C/W
PD
VINMAX VOUTMIN
–
()ILOADMAX
≈
4.1
()
3.0 .975
×
()
–
[]
=
200 10
3
–
×
220 mW
=
PDMAX
TJMAX TAMAX
–
()
θJA
--------------------------------------------
=
125 55
–
()
200
-------------------------
=
350 mW
=



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