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MPC7450EC Datasheet(PDF) 43 Page - Motorola, Inc

Part # MPC7450EC
Description  Freescale Semiconductor, Inc.
PDF  52 Pages
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Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPC7450EC Datasheet(HTML) 43 Page - Motorola, Inc

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MOTOROLA
MPC7450 RISC Microprocessor Hardware Specifications
43
System Design Information
Figure 23. JTAG Interface Connection
1.9.9
Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
HRESET
HRESET
From Target
Board Sources
HRESET
13
SRESET
SRESET
SRESET
NC
NC
11
VDD_SENSE
6
51
15
2 k
Ω
10 k
Ω
10 k
Ω
10 k
Ω
OVDD
OVDD
OVDD
OVDD
CHKSTP_IN
CHKSTP_IN
8
TMS
TDO
TDI
TCK
TMS
TDO
TDI
TCK
9
1
3
4
TRST
7
16
2
10
12
(if any)
142
Key
Notes:
1. RUN/STOP, normally found on pin 5 of the COP header, is not implemented on the MPC7450.
Connect pin 5 of the COP header to OVDD with a 10 KΩ pull-up resistor.
2. Key location; Pin 14 is not physically present on the COP header.
.
QACK
OVDD
OVDD
10 k
Ω
OVDD
2 k
Ω3
GND
3. Component not populated. Populate only if JTAG interface is unused.
TRST
10 k
Ω
OVDD
10 k
Ω
10 k
Ω
QACK
2 k
Ω4
QACK
CHKSTP_OUT
CHKSTP_OUT
3
13
9
5
1
6
10
2
15
11
7
16
12
8
4
KEY
No pin
COP Connector
Physical Pin Out
4. Component not populated. Populate only if debug tool does not drive QACK.
10 k
Ω5
OVDD
5. Populate only if debug tool uses an open-drain type output and does not actively deassert QACK.
1
2 k
Ω4
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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