iC-DC

2-CHANNEL BUCK/BOOST DC/DC CONVERTER

Rev B1, Page 4/19

PACKAGING INFORMATION

PIN CONFIGURATION

QFN24-4x4

(topview)

1

2

3

4

5

6

7 8 9 10 11 12

13

14

15

16

17

18

19

20

21

22

23

24

<D-CODE>

<A-CODE>

<P-CODE>

PIN FUNCTIONS

No. Name

Function

1 RREF

Reference Resistor

2 GNDA

Analog Ground

3 CFG1

VCC1 Configuration 3.3/5.0 V or

1.5 V to 5.5 V with ext. R Divider

4 CFG2

VCC2 Configuration2.5/3.3 V or

1.5 V to 5.5 V with ext. R Divider

5 TEST

Test Input

6 POE2

Power Output Enable VCC2 Voltage

7 V2OK

Error Output VCC2 Voltage

8 VCC2

1.5 V to 5.5 V Lin. Regulator Output 2

9 VH2

Intermediate Voltage 2

for VCC2 Regulator

10 VH1

Intermediate Voltage 1

for VCC1 Regulator

11 VCC1

1.5 V to 5.5 V Lin. Regulator Output 1

12 V1OK

Error Output VCC1 Voltage

13 POE1

Power Output Enable VCC1 Voltage

14 VH

Intermediate Voltage

15 VHL

Inductor Terminal VH

16 GND

Power Ground

17 VBL

Inductor Terminal VB

18 VBR

Reverse Protected Supply Voltage

19 VB

+4 V to +36 V Supply Voltage

20 ENV1

VCC1 Linear Regulator Activation

21 ENV2

VCC2 Linear Regulator Activation

22 VBROK Error Output Supply Voltage

23 TOK

Error Output Overtemperature

24 NAUT

Error Output Autarky

BP

Backside Paddle (Thermal Pad)

IC top marking: <P-CODE> = product code, <A-CODE> = assembly code (subject to changes), <D-CODE> = date code (subject to changes);

To improve the heat dissipation connect the backside paddle to an extended copper area connected to GND. Avoid any current flow across the paddle.

The heat distribution can be supported by connecting further PCB layers using thermal vias. If those need to be placed below the paddle, prefer blind vias.

GNDA should also be directly connected to neutral point GND. Ground loops should be avoided.