LAN91C100FD datasheet(67/68 Pages) SMSC

67 / 68 page

SMSC DS – LAN91C100FD REV. B

Page 67

Rev. 05/31/2000

FIGURE 28 - 208 PIN TQFP PACKAGE OUTLINES

NOM

30.00

15.00

28.00

30.00

15.00

28.00

0.60

1.00

0.50 BSC

DIM

D/2

E/2

ccc

REMARK

Overall Package Height

Standoff

Body Thickness

X Span

1/2 X Span Measure From Centerline

X Body Size

Y Span

1/2 Y Span Measure From Centerline

Y Body Size

Lead Frame Thickness

Lead Foot Length From Centerline

Lead Length

Lead Pitch

Lead Foot Angle

Lead Width

Lead Shoulder Radius

Lead Foot Radius

Coplanarity (Assemblers)

Coplanarity (Test House)

MIN

0.05

1.35

29.80

14.90

27.90

29.80

14.90

27.90

0.09

0.45

0.17

0.08

MAX

1.60

0.15

1.45

30.20

15.10

28.10

30.20

15.10

28.10

0.23

0.75

0.27

0.20

0.0762

0.08

Notes:

Controlling Unit: Millimeter.

Tolerance on the position of the leads is 0.04mm maximum.

Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25mm.

Dimension for foot length L measured at the gauge plane 0.25mm above the seating plane, is 0.78-1.08mm.

Details of pin 1 identifier are optional but must be located within the zone indicated.

LAN91C100FD Datasheet(PDF) 67 Page - SMSC Corporation

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