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LTC3830ES Datasheet(PDF) 9 Page - Linear Technology |
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LTC3830ES Datasheet(HTML) 9 Page - Linear Technology |
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9 / 24 page ![]() 9 LTC3830/LTC3830-1 sn3830 3830fs APPLICATIO S I FOR ATIO Similarly, the MAX comparator forces the output to 0% duty cycle if the feedback signal is greater than 40mV above the internal reference. To prevent these two com- parators from triggering due to noise, the MIN and MAX comparators’ response times are deliberately delayed by two to three microseconds. These two comparators help prevent extreme output perturbations with fast output load current transients, while allowing the main feedback loop to be optimally compensated for stability. Thermal Shutdown The LTC3830/LTC3830-1 have a thermal protection cir- cuit that disables both gate drivers if activated. If the chip junction temperature reaches 150 °C, both G1 and G2 are pulled low. G1 and G2 remain low until the junction temperature drops below 125 °C, after which, the chip resumes normal operation. Soft-Start and Current Limit The 16-lead LTC3830 devices include a soft-start circuit that is used for start-up and current limit operation. The LTC3830-1 only has the soft-start function; the current limit function is disabled. The 8-lead LTC3830 has both the soft-start and current limit function disabled. The SS pin requires an external capacitor, CSS, to GND with the value determined by the required soft-start time. An internal 12 µA current source is included to charge CSS. During power-up, the COMP pin is clamped to a diode drop (B-E junction of QSS in the Block Diagram) above the voltage at the SS pin. This prevents the error amplifier from forcing the loop to maximum duty cycle. The LTC3830/LTC3830-1 operate at low duty cycle as the SS pin rises above 0.6V (VCOMP ≈ 1.2V). As SS continues to rise, QSS turns off and the error amplifier takes over to regulate the output. The MIN comparator is disabled during soft-start to prevent it from overriding the soft-start function. The 16-lead LTC3830 devices include yet another feed- back loop to control operation in current limit. Just before every falling edge of G1, the current comparator, CC, samples and holds the voltage drop measured across the external upper MOSFET, Q1, at the IFB pin. CC compares the voltage at IFB to the voltage at the IMAX pin. As the peak current rises, the measured voltage across Q1 increases due to the drop across the RDS(ON) of Q1. When the voltage at IFB drops below IMAX, indicating that Q1’s drain current has exceeded the maximum level, CC starts to pull current out of CSS, cutting the duty cycle and controlling the output current level. The CC comparator pulls current out of the SS pin in proportion to the voltage difference between IFB and IMAX. Under minor overload conditions, the SS pin falls gradually, creating a time delay before current limit takes effect. Very short, mild overloads may not affect the output voltage at all. More significant overload conditions allow the SS pin to reach a steady state, and the output remains at a reduced voltage until the overload is re- moved. Serious overloads generate a large overdrive at CC, allowing it to pull SS down quickly and preventing damage to the output components. By using the RDS(ON) of Q1 to measure the output current, the current limiting circuit eliminates an expensive discrete sense resistor that would otherwise be required. This helps minimize the number of components in the high current path. The current limit threshold can be set by connecting an external resistor RIMAX from the IMAX pin to the main VIN supply at the drain of Q1. The value of RIMAX is determined by: RIMAX = (ILMAX)(RDS(ON)Q1)/IIMAX where: ILMAX = ILOAD + (IRIPPLE/2) ILOAD = Maximum load current IRIPPLE = Inductor ripple current = ()( ) ()()( ) VV V fL V IN OUT OUT OSC O IN – fOSC = LTC3830 oscillator frequency = 200kHz LO = Inductor value RDS(ON)Q1 = On-resistance of Q1 at ILMAX IIMAX= Internal 12µA sink current at IMAX |
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