PC107A datasheet(39/50 Pages) ATMEL

39 / 50 page

PC107A [Preliminary]

2137C–HIREL–03/04

Mechanical Dimensions

Figure 28 shows the top surface, side profile, and pinout of the PC107A, 503 PBGA

package.

Figure 28. PC107A Package Dimensions and Pinout Assignments

24Xe

Notes: 1. Dimensioning and tolerancing per A.

2. Dimensions in millimeters.

3. Dimension b is the maximum solder ball diameter measured parallel to datum A.

4. D2 and E2 define the area occupied on the die and underfill actual size of this area may be smaller than shown.

D3 and E3 are the minimum clearance from the package edge to the chip capacitors.

5. Capacitors may not be present on all devices.

6. Caution must be taken not to short expose metal capacitor pads on package top.

0.2 A

Millimeters

DIM

Min

Max

2.75

0.50

0.70

1.00

1.20

0.80

0.82

0.90

0.60

0.90

33 GSC

30.48 BSC

12.50

3.43

5.00

1.27 BSC

33 GSC

30.48 BSC

14.50

3.43

9.00

11 13 15

17 19 21 23 25

10 12 14 16

18 20 22 24

503 x

∅ b

24Xe

0.3

0.15

0.2

0.25 A

Side View

Bottom View

0.35 A

12.5 max

5 min

14.5 Max

Top View

9 min

INDEX

0.9

0.82

1.2

2.75 max

0.7

0.5

503X

SEATING

PLANE

PC107A Datasheet(PDF) 39 Page - ATMEL Corporation

PC107A Datasheet(HTML) 39 Page - ATMEL Corporation

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