T0501SA datasheet(4/7 Pages) CITC

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Application Information

Recommended Mounting Pattern

0.270

0.250

0.298

0.272

0.175

Stencil Aperture

Mounting Pad

Package

Assembly Guidelines

The small size of this device means that some care

must be taken during the mounting process to insure

reliable solde joint. The table below provides

CITC recommended assembly guidelines for

Mounting this device. The ﬁgure at the right details

CITC recommended aperture based on the

below recommendations. Not that these are only

recommendations and should serve only as a starting

point for design since there are many factors that

aﬀect the assembly process. The exact manufactur-

ing parameters will require some experimentation to

get the desired solder application.

Solder Stencil Design

Laser cut, Electro-polished

Aperture shape

Rectangular with rounded

corners

Solder Stencil Thickness

0.100 mm (0.004")

Solder Paste Type

Type 4 size sphere or smaller

Solder Reﬂow Proﬁle

Per JEDEC J-STD-020

PCB Solder Pad Desig

Non-Solder mask deﬁned

PCB Pad Finish

OSP OR NiAu

Document ID : DS-22V02

Revised Date : 2016/08/29

Revision : C

Ultra-Low Capacitance ESD Protection Device

T0501SA

Chip Integration Technology Corporation

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