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T0501SA Datasheet(PDF) 1 Page - Chip Integration Technology Corporation

Part # T0501SA
Description  Ultra-Low Capacitance ESD Protection Device
PDF  7 Pages
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Manufacturer  CITC [Chip Integration Technology Corporation]
Direct Link  http://www.citcorp.com.tw/english/index.php
Logo CITC - Chip Integration Technology Corporation

T0501SA Datasheet(HTML) 1 Page - Chip Integration Technology Corporation

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Document ID : DS-22V02
Revised Date : 2016/08/29
Revision : C
Ultra-Low Capacitance ESD Protection Device
T0501SA
Chip Integration Technology Corporation
Features
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Description
Applications
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Mechanical Characteristics
Circuit Diagram
I/O_1
I/O_2
Pin Configuration
DFN0603
(Top View)
T0501SA are ultra low capacitance ESD
protection devices designed to protect
high speed data interfaces. They are designed
to replace 0201 size mul- tilayer varistors
(MLVs) in portable applications such as cell
phones,notebook computers, and other portable
electronics. This device offers desirable
characteristics for board level protection
including fast response time, low operating
and clamping voltage, and no device degradation.
T0501SA has a typical capacitance of only
0.25pF.This allows it to be used on circuits
operating.
T0501SA is in a 2-pin DFN0603 package. It
measures 0.6 x 0.3 mm with a nominal height of
only 0.25mm.Leads are finished with lead-free
finished with lead-free
NiAu. Each device will protect one line operating
at 5 volts. It gives the designer the flexibility to
protect single lines in applications where arrays
are not practical. The combination of small size
and high ESD surge capability makes them
ideal for use in portable applications such as
cellular phones, digital cameras, and Mp3 players.
Transient protection for high-speed data lines
IEC 61000-4-2 (ESD)
± 22kV ( Contact)
Protects one high-speed data line
Low reverse current:< 10nA typical (VR=5V)
Working voltage: 5V
Low capacitance: 0.25pF typical
Dynamic resistance: 0.90 Ohms (Typ)
Solid-state silicon-avalanche technology
HDMI 1.3/1.4 and HDMI 2.0
USB 2.0 and USB 3.0
MHL
LVDS Interfaces
FM Antenna
PCI Express
eSATA Interfaces
DFN0603-2L package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Molding compound flammability rating: UL 94V- 0
Packaging : Tape and Reel
± 25kV ( Air)
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