8

NDS Series

tech.support@psbel.com

RECOMMENDED REFLOW PROFILE (measured at the leads of the converter)

PRODUCT

PRE-HEAT RAMP

PRE-HEAT SOAKING

RAMP

TO

REFLOW

REFLOW

COOLING

From

To

Rate

From

To

Time

Rate

Time

above

liquids

Peak

temp.

Time within

±5 ºC of

peak temp

Time

to

peak

Rate

ºC

ºC

ºC/s

ºC

ºC

s

ºC

s

ºC

s

s

ºC/s

M6

(Sn-Pb eutectic)

25

150

2

150

183

90-120

2

45

220±5

10

180

3

M6G (lead free)

25

180

2

180

217

90-120

2

45

240±5

10

210

3

WORST CASE REFLOW PARAMETERS FOLLOWING J-STD-020D (measured in the center, on top side of the converter)

PRODUCT

PRE-HEAT RAMP

PRE-HEAT SOAKING

RAMP

TO

REFLOW

REFLOW

COOLING

From

To

Rate

From

To

Max.

Time

Rate

Max.

time

above

liquids

Max.

peak

temp.

Max. time

within ±5

ºC of peak

temp

Max.

time

to

peak

Rate

ºC

ºC

ºC/s

ºC

ºC

s

ºC

s

ºC

s

s

ºC/s

M6

(Sn-Pb eutectic)

25

150

3

100

150

120

3

45

230

10

360

6

M6G (lead free)

25

180

3

150

200

120

3

45

260

10

480

6

The following soldering instructions must be observed to prevent failure or significant degradation of the module

performance. Power Bel Solutions will not honor any warranty claims arising from failure to observe these instructions. The

lead-frame is constructed for a high temperature glass filled, UL94 V-0 flame retardant, dually orthophthalate molding

compound commonly used for packaging of electronics components. It has passed NASA outgassing tests, and is certified

to MIL-M-14. The coefficient of thermal expansion is equivalent to FR4.

The gull wing leads are formed to ensure optimal solder join strength and structure. Furthermore they facilitate visual

inspection (manual or automatic). The leads are formed from a 97% Cu alloy plated with Ni and matte Sn. This material is

commonly used in the manufacture of integrated circuits. It has good corrosion resistance and exhibits the nobility inherent

to all high copper alloys. Unlike brasses, this material is essentially immune to stress corrosion cracking. It also exhibits

excellent solderability. It is readily wetted by solders and performs well in standard solderability tests. (Dip of Class II or

better).

The product is manufactured with a patented process, which is fully automated, and ‘in-line’. This ensures that there is no

contamination or mechanical stress on the lead-frame so that the co planarity and solderability are maintained. The product

is shipped in JEDEC trays to ensure preservation of the co-planarit and enable fully automated assembly in the final

application. Mind the marking for pin 1! These products are approved for forced convection reflow soldering only. Products

RoHS-compliant for all 6 substances (model designation ending with -M6G) allow for a solder profile with higher

temperatures; see tables below.

The product is designed with a large flat area in the center of the top surface to serve as a pick up point for automated

vacuum pick and place equipment. The ‘open board’ construction of the unit ensures that weight is kept to a minimum.

However due to the relatively large size of the component, a large nozzle (>6.0mm, depending on vacuum pressure) is

recommended for picking and placing. The unit may also be automatically handled using ‘odd-form’ placement equipment,

with mechanical grippers. For this type of equipment the end edges of the device, which have no leads and also feature the

greatest dimensional accuracy, should be used as pick-up points.