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DLP650LE Datasheet(PDF) 5 Page - Texas Instruments

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Part # DLP650LE
Description  0.65 WXGA DMD
PDF  38 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

DLP650LE Datasheet(HTML) 5 Page - Texas Instruments

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DLP650LE
www.ti.com
DLPS095 – NOVEMBER 2017
Product Folder Links: DLP650LE
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
Pin Functions (continued)
PIN
NET LENGTH
(mils)
SIGNAL
TYPE(1)
DESCRIPTION
NAME
NO.
(2)
Power supply pins required for all DMD operating modes are VSS, VBIAS, VCC, VCCI, VOFFSET, and VRESET.
MICROMIRROR BIAS RESET INPUTS
MBRST(0)
C3
507.20
I
Non–logic compatible Micromirror Bias
Reset signals. Connected directly to the
array of pixel micromirrors. Used to hold or
release the micromirrors. Bond Pads
connect to an internal pull–down resistor.
MBRST(1)
D2
576.83
MBRST(2)
D3
545.78
MBRST(3)
E2
636.33
MBRST(4)
G3
618.42
MBRST(5)
E1
738.25
MBRST(6)
G2
718.82
MBRST(7)
G1
777.04
MBRST(8)
N3
543.29
MBRST(9)
M2
612.93
MBRST(10)
M3
580.97
MBRST(11)
L2
672.43
MBRST(12)
J3
653.61
MBRST(13)
L1
764.00
MBRST(14)
J2
764.37
MBRST(15)
J1
813.14
SCP CONTROL
SCPCLK
A8
I
Serial Communications Port Clock. Bond
Pad connects to an internal pulldown circuit.
SCPDI
A5
I
Serial Communications Port Data. Bond Pad
connects to an internal pulldown circuit.
SCPENZ
B7
I
Active low serial communications port
enable. Bond pad connects to an internal
pulldown circuit.
SCPDO
A9
O
Serial communications port output.
OTHER SIGNALS
EVCC
A3
P
Do Not Connect on the DLP system board.
MODE_A
A4
415.1
I
Data Bandwidth Mode Select. Bond Pad
connects to an internal pull–down circuit.
Refer to Table 4 for DLP system board
connection information.
PWRDNZ
B9
110.38
I
Active Low Device Reset. Bond Pad
connects to an internal pull–down circuit.
POWER
VCC
(2)
B11,
B12,
B13,
B16,
R12,
R13,
R16, R17
P
Power supply for low voltage CMOS logic.
Power supply for normal high voltage at
micromirror address electrodes.
VCCI
(2)
A12,
A14,
A16,
T12,
T14, T16
P
Power supply for low voltage CMOS LVDS
interface.
VOFFSET
(2)
C1, D1,
M1, N1
P
Power supply for high voltage CMOS logic.
Power supply for stepped high voltage at
micromirror address electrodes.



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