LTC6409

22

6409fb

For more information www.linear.com/LTC6409

PACKAGE DESCRIPTION

0.40

±0.10

0.50

±0.10

0.80

BSC

BOTTOM VIEW—EXPOSED PAD

SIDE VIEW

0.75

±0.05

R = 0.13

TYP

0.20 REF

(UDB10) DFN 0910 REV A

0.70

±0.10

1

2

3

5

6

7

8

10

0.60

±0.10

3.00

±0.05

0.90

±0.10

DETAIL A

0.25

±0.10

0.05

±0.10

2.00

±0.05

DETAIL A

0.25

±0.05

0.50 BSC

UDB Package

10-Lead Plastic QFN (3mm

× 2mm)

(Reference LTC DWG # 05-08-1848 Rev A)

0.00 – 0.05

0.90

±0.05

DETAIL B

0.25

±0.05

0.05

±0.05

0.25

±0.05

0.85

±0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

3.50

±0.05

1.10

±0.05

0.65

±0.05

0.75

±0.05

2.50

±0.05

PACKAGE

OUTLINE

0.50 BSC

DETAIL B

0.95

±0.05

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

Please refer to http://www.linear.com/product/LTC6409#packaging for the most recent package drawings.