LTC3371

24

3371fb

For more information www.linear.com/LTC3371

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/product/LTC3371#packaging for the most recent package drawings.

5.00 ±0.10

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE

OUTLINE M0-220 VARIATION WHKD

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PIN 1

TOP MARK

(SEE NOTE 6)

37

1

2

38

BOTTOM VIEW—EXPOSED PAD

5.50 REF

5.15 ±0.10

7.00 ±0.10

0.75 ±0.05

R = 0.125

TYP

R = 0.10

TYP

0.25 ±0.05

(UH) QFN REF C 1107

0.50 BSC

0.200 REF

0.00 – 0.05

RECOMMENDED SOLDER PAD LAYOUT

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

3.00 REF

3.15 ±0.10

0.40 ±0.10

0.70 ±0.05

0.50 BSC

5.5 REF

3.00 REF

3.15 ±0.05

4.10 ±0.05

5.50 ±0.05

5.15 ±0.05

6.10 ±0.05

7.50 ±0.05

0.25 ±0.05

PACKAGE

OUTLINE

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 NOTCH

R = 0.30 TYP OR

0.35

× 45° CHAMFER

UHF Package

38-Lead Plastic QFN (5mm

× 7mm)

(Reference LTC DWG # 05-08-1701 Rev C)