MP2678 datasheet(2/11 Pages) MPS

2 / 11 page

MP2678 – LI+ BATTERY CHARGER PROTECTION CIRCUIT WITH LDO MODE

MP2678 Rev. 1.0

www.MonolithicPower.com

1/6/2011

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

VOVP

Package

Top Marking

Free Air Temperature (TA)

MP2678EG-104

10.4V

QFN8 (2mm×2mm)

-20

°C to +85°C

*For different input OVP version, add suffix –XXX (e.g. MP2678EG-73 is 7.3V OVP)

Contact factory for availability.

For Tape & Reel, add suffix –Z (eg. MP2678EG–104–Z);

For RoHS, compliant packaging, add suffix –LF (eg. MP2678EG–104–LF–Z).

PACKAGE REFERENCE

ABSOLUTE MAXIMUM RATINGS (1)

VIN to GND.....................................-0.3V to 30V

OUT to GND .....................................-0.3V to 7V

Others to GND ..................................-0.3V to 7V

Continuous Power Dissipation...(TA = +25°C)

(2)

....................................................…....1.25W

Junction Temperature.................-20ºC to 150ºC

Storage Temperature..................-65ºC to 150ºC

ESD Susceptibility(3)

HBM (Human Body Mode) ..........................2kV

MM (Machine Mode) ................................ 200V

Recommended Operating Conditions

(4)

Supply Input Voltage ..................... 3.3V to VOVP

Output Current ............................................ 1.5A

Maximum Junction Temp. (TJ) ............... +125°C

Thermal Resistance

(5)

θJA

θJC

QFN8 2mm×2mm ................... 80 ...... 60...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) Devices

are

ESD

sensitive.

Handling

precaution

recommended.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

TOP VIEW

VIN

GND

FLT

OUT

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