FN7822 Rev 2.00

Page 31 of 34

December 8, 2014

ISL8225M

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Reflow Parameters

Due to the low mount height of the QFN, "No Clean" Type 3 solder

paste, per ANSI/J-STD-005, is recommended. Nitrogen purge is

also recommended during reflow. A system board reflow profile

depends on the thermal mass of the entire populated board, so it

is not practical to define a specific soldering profile just for the

QFN. The profile given in Figure 43 is provided as a guideline to

customize for varying manufacturing practices and applications.

FIGURE 47. DERATING CURVE 12V/7.5V

0

2

4

6

8

10

12

14

25

45

65

85

105

125

TEMPERATURE (°C)

400LFM

200LFM

0LFM

FIGURE 48. TYPICAL REFLOW PROFILE

0300

100

150

200

250

350

0

50

100

150

200

250

300

DURATION (s)

SLOW RAMP (3°C/s MAX)

AND SOAK FROM +100°C

TO +180°C FOR 90s~120s

RAMP RATE

1.5°C FROM +70°C TO +90°C

PEAK TEMPERATURE +230°C~+245°C;

TYPICALLY 60s-70s ABOVE +220°C

KEEP LESS THAN 30s WITHIN 5°C OF PEAK TEMP.