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ISL8225MEVAL4Z Datasheet(PDF) 25 Page - Renesas Technology Corp

Part # ISL8225MEVAL4Z
Description  Dual 15A/Single 30A Step-Down Power Module
PDF  34 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ISL8225MEVAL4Z Datasheet(HTML) 25 Page - Renesas Technology Corp

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ISL8225M
FN7822 Rev 2.00
Page 25 of 34
December 8, 2014
Current Share
In parallel operations, the share bus voltages (ISHARE) of
different modules must tie together. The ISHARE pin voltage is
set by an internal resistor and represents the average current of
all active modules. The average current signal is compared with
the local module current, and the current share error signal is fed
into the current correction block to adjust each module’s PWM
pulse accordingly. The current share function provides at least
10% overall accuracy between modules. The current share bus
works for up to 12 phases without requiring an external clock. A
470pF ~1nF capacitor is recommended for each ISHARE pin.
In current sharing scheme, all slave channels have the feedback
loops disabled with the VSEN- pin tied to VCC. The master
channel can control all modules with COMP and ISHARE pins tied
together. For phase-shift setting, all VMON pins of slave channels
are needed to set 0.6V for monitoring use only. Typically, the
slaved VMON pins can be tied together with a resistor divider to
VOUT. However, if the MODE pin is tied to VCC for mode setting,
the related VMON2 pin is needed to tie to SGND with a 953Ω
resistor and 22nF capacitor, as shown in Figure 25 on page 17. If
there are multiple modules paralleled with the MODE pins tied to
VCC, each VMON2 pin of the slave module needs to have a 953Ω
resistor to GND while all VMON1 pins of the slave modules can be
tied together with a resistor divider from VOUT to GND, as shown
in Figure 26 on page 18. Also see Table 3 for VMON settings.
Because of the typical 5.4V VCC and 7.5kΩ resistor between
MODE pin and VMON2 pin, the 953Ω resistor maintains VMON2
pin voltage close to 0.6V, so output OVP/UVP (caused by VMON2
voltage too high or too low) will not be triggered falsely by part to
part tolerance at mass production. The 22nF capacitor is used to
avoid output UVP/OVP triggered during input start-up.
Overvoltage Protection (OVP)
The overvoltage (OV) protection indication circuitry monitors
voltage on the VMON pin. OV protection is active from the
beginning of soft-start. An OV condition (>120%) would latch the
IC off. In this condition, the high-side MOSFET (Q1 or Q3) latches
off permanently. The low-side MOSFET (Q2 or Q4) turns on
immediately at the time of OV trip and then turns off
permanently after the output voltage drops below 87%. EN and
PGOOD are also latched low in an OV event. The latch condition
can be reset only by recycling VCC.
There is another non-latch OV protection (113% of target level).
When EN is low and output is over 113% OV, the low-side
MOSFET turns on until output drops below 87%. This action
protects the power trains when even a single channel of a
multi-module system detects OV. The low-side MOSFET always
turns on when EN = LOW and the output voltage rises above
113% (all EN pins are tied together) and turns off after the output
drops below 87%. Thus, in a high phase count application
(multi-module mode), all cascaded modules can latch off
simultaneously via the EN pins (EN pins are tied together in
multi-phase mode). Each channel shares the same sink current
to reduce stress and eliminate bouncing among phases.
Over-Temperature Protection (OTP)
When the junction temperature of the internal controller is
greater than +150°C (typically), the EN pin is pulled low to inform
other cascaded channels via their EN pins. All connected ENs
stay low and then release after the module’s junction
temperature drops below +125°C (typically), a +25°C hysteresis
(typically).
Overcurrent Protection (OCP)
The OCP peak level is set to about 20A for each channel, but the OC
trip point can vary, due mainly to MOSFET rDS(ON) variations (over
process, current, and temperature). The OCP can be increased by
increasing the switching frequency since the inductor ripple is
reduced. However, the module efficiency drops accordingly with
more switching loss. When OCP is triggered, the controller pulls
EN low immediately to turn off all switches. The OCP function is
enabled at start-up and has a 7-cycle delay before it triggers.
In multi-module operation, ISHARE pins can be connected to
create VISHARE, which represents the average current of all
active channels. Total system currents are compared with a
precision threshold to determine the overcurrent condition. Each
channel also has an additional overcurrent set point with a
7-cycle delay. This scheme helps protect modules from damage
in multi-module mode by having each module carry less current
than the set point.
For overload and hard short conditions, overcurrent protection
reduces the regulator RMS output current to much less than full
load by putting the controller into hiccup mode. A delay equal to
three soft-start intervals is entered to allow time to clear the
disturbance. After the delay time, the controller initiates a
soft-start interval. If the output voltage comes up and returns to
regulation, PGOOD transitions high. If the OC trip is exceeded
during the soft-start interval, the controller pulls EN low again.
The PGOOD signal remains low, and the soft-start interval is
allowed to expire. Another soft-start interval is initiated after the
delay interval. If an overcurrent trip occurs again, this same cycle
repeats until the fault is removed. Since the output voltage may
trigger the OVP if the output current changes too fast, the module
can go into latch-off mode. In this case, the module needs to be
restarted.
Frequency Synchronization and Phase Lock
Loop
The SYNC pin has two primary capabilities: fixed frequency
operation and synchronized frequency operation. The ISL8225M
has an internally set fixed frequency of 500kHz. By tying a
resistor (RSYNC) to SGND from the SYNC pin, the switching
frequency can be set to be more than 500kHz. To increase the
switching frequency, select an externally connected resistor,
RSYNC, from SYNC to SGND according to the frequency setting
curve shown in Figure 33. See Table 1 for RSYNC at commonly
used frequency.



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