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OPA1678 Datasheet(PDF) 3 Page - Texas Instruments |
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OPA1678 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 46 page ![]() 1 OUT A 8 V+ 2 ±IN A 7 OUT B 3 +IN A 6 ±IN B 4 V± 5 +IN B Not to scale Thermal Pad 1 OUT A 8 V+ 2 ±IN A 7 OUT B 3 +IN A 6 ±IN B 4 V± 5 +IN B Not to scale 3 OPA1678, OPA1679 www.ti.com SBOS855A – FEBRUARY 2017 – REVISED MAY 2018 Product Folder Links: OPA1678 OPA1679 Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated 5 Pin Configuration and Functions OPA1678 D and DGK Packages 8-Pin SOIC and VSSOP Top View OPA1678 DRG Package 8-Pin SON With Exposed Thermal Pad Top View Pin Functions: OPA1678 PIN I/O DESCRIPTION NAME NO. –IN A 2 I Inverting input, channel A +IN A 3 I Noninverting input, channel A –IN B 6 I Inverting input, channel B +IN B 5 I Noninverting input, channel B OUT A 1 O Output, channel A OUT B 7 O Output, channel B V– 4 — Negative (lowest) power supply V+ 8 — Positive (highest) power supply Thermal pad Exposed thermal die pad on underside; connect thermal die pad to V–. Soldering the thermal pad improves heat dissipation and provides specified performance. |
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