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OPA1678, OPA1679

SBOS855A – FEBRUARY 2017 – REVISED MAY 2018

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA1678

OPA1678

UNIT

D (SOIC)

DGK (VSSOP)

DRG (SON)

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

144

219

66.9

°C/W

Junction-to-case (top) thermal resistance

77

79

54.5

°C/W

Junction-to-board thermal resistance

62

104

40.4

°C/W

Junction-to-top characterization parameter

28

15

1.9

°C/W

Junction-to-board characterization parameter

61

102

40.4

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

10.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA1679

OPA1679

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

90

127

°C/W

Junction-to-case (top) thermal resistance

55

47

°C/W

Junction-to-board thermal resistance

44

59

°C/W

Junction-to-top characterization parameter

20

5.5

°C/W

Junction-to-board characterization parameter

44

58

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W