MAX86140 datasheet(3/89 Pages) MAXIM

3 / 89 page

VDD_ANA to GND_ANA ......................................-0.3V to +2.2V

VDD_DIG to GND_ANA.......................................-0.3V to +2.2V

VDD_ANA to VDD_ANA.......................................-0.3V to +0.3V

PGND to GND_ANA.............................................-0.3V to +0.3V

SCLK, SDO, SDI, CSB, INT to GND_ANA ..........-0.3V to +6.0V

GND_DIG to GND_ANA.......................................-0.3V to +0.3V

VLED to PGND.....................................................-0.3V to +6.0V

LED_DRV1 to PGND ................................-0.3V to VLED + 0.3V

LED_DRV2 to PGND ................................ -0.3V to VLED + 0.3V

LED_DRV3 to PGND ................................-0.3V to VLED + 0.3V

PD1_IN to GND_ANA...........................................-0.3V to +2.2V

PD2_IN to GND_ANA .......................................... -0.3V to +2.2V

PD_GND to GND_ANA........................................-0.3V to +0.3V

All other pins to GND_ANA..................................-0.3V to +2.2V

Output Short-Circuit Duration....................................Continuous

Continuous Input Current Into Any Pin

(except LED_DRVx Pins) .............................................±20mA

Continuous Power Dissipation (WLP

(derate 5.5mW/°C above +70°C)) .............................. 440mW

Operating Temperature Range........................... -40°C to +85°C

Storage Temperature Range............................ -40°C to +105°C

PACKAGE CODE

N201A2+1

Outline Number

21-100134

Land Pattern Number

Refer to

Application Note 1891

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θJA)

55.49°C/W

Junction to Case (θJC)

N/A

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

5 x 4 WLP

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

For the latest package outline information and land patterns (footprints), go to

www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Package Information

www.maximintegrated.com

Maxim Integrated │ 3

MAX86140/

MAX86141

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