SSM3582BCPZ datasheet(59/59 Pages) AD

59 / 59 page

Data Sheet

SSM3582

Rev. 0| Page 59 of 59

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

6.10

6.00 SQ

5.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.45

0.40

0.35

0.20 MIN

*4.70

4.60 SQ

4.50

*COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5

WITH EXCEPTION TO EXPOSED PAD DIMENSION.

Figure 88. 40-Lead Lead Free Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.75 mm Package Height

(CP-40-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

SSM3582BCPZ

−40°C to +85°C

40-Lead Lead Free Chip Scale Package [LFCSP]

CP-40-7

SSM3582BCPZRL

−40°C to +85°C

40-Lead Lead Free Chip Scale Package [LFCSP]

CP-40-7

SSM3582BCPZR7

−40°C to +85°C

40-Lead Lead Free Chip Scale Package [LFCSP]

CP-40-7

EVAL-SSM3582Z

Evaluation Board

1 Z = RoHs Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

registered trademarks are the property of their respective owners.

D13399-0-4/16(0)

SSM3582BCPZ Datasheet(PDF) 59 Page - Analog Devices

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