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LPC844 Datasheet(PDF) 84 Page - NXP Semiconductors |
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LPC844 Datasheet(HTML) 84 Page - NXP Semiconductors |
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84 / 97 page ![]() LPC84x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved. Product data sheet Rev. 1.7 — 27 February 2018 84 of 97 NXP Semiconductors LPC84x 32-bit Arm Cortex-M0+ microcontroller Fig 42. Package outline HVQFN33 (5 x 5 x 0.85 mm) References Outline version European projection Issue date IEC JEDEC JEITA MO-220 hvqfn33f_po 11-10-11 11-10-17 Unit(1) mm max nom min 0.85 0.05 0.00 0.2 5.1 4.9 3.75 3.45 5.1 4.9 3.75 3.45 0.5 3.5 A1 Dimensions (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm bc 0.30 0.18 D(1) A(1) Dh E(1) Eh ee1 e2 L 3.5 vw 0.1 0.1 y 0.05 0.5 0.3 y1 0.05 0 2.5 5 mm scale 1/2 e A C B v C w terminal 1 index area A A1 c detail X y y1 C e L Eh Dh e e1 b 916 32 25 24 17 8 1 X D E C B A e2 terminal 1 index area 1/2 e |
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