© 2007 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSA321

• Rev.1.0.6

11

Physical Dimensions

A

B

C

SEATING

PLANE

DETAIL A

PIN#1 IDENT

RECOMMENDED

LAND PATTERN

NOTES:

A. PACKAGE DOES NOT FULLY CONFORM TO

JEDEC STANDARD.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. LAND PATTERN RECOMMENDATION IS

BASED ON FSC DESIGN ONLY.

E. DRAWING FILENAME: MKT-UMLP10Arev3.

TOP VIEW

BOTTOM VIEW

0.15 C

0.08 C

0.15 C

2X

2X

SIDE VIEW

0.10 C

0.05

3

6

1

0.10 C A B

0.05 C

0.55 MAX.

10

1.40

1.80

0.40

0.15

0.25

(10X)

0.35

0.45

(9X)

1.70

2.10

0.40

0.663

0.563

(9X)

0.225

(10X)

1

0.152

0.10

0.10

0.55

0.45

0.10

DETAIL A

SCALE : 2X

1.85

1.45

0.55

0.40

0.225

(10X)

9X

0.45

PIN#1 IDENT

OPTIONAL MINIMIAL

TOE LAND PATTERN

SCALE : 2X

LEAD

OPTION 1

SCALE : 2X

LEAD

OPTION 2

PACKAGE

EDGE

Figure 18. 10-Lead, Quad Ultrathin Molded Leadless Package (UMLP)

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obtain the most recent rev

ision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,

specifically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

.