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LDS8680 Datasheet(PDF) 6 Page - IXYS Corporation

Part # LDS8680
Description  800 mA White LED Driver for Photo Flash
Download  12 Pages
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Manufacturer  IXYS [IXYS Corporation]
Direct Link  http://www.ixys.com
Logo IXYS - IXYS Corporation

LDS8680 Datasheet(HTML) 6 Page - IXYS Corporation

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LDS8680
© 2009 IXYS Corp.
6
Doc. No. 8680_DS, Rev. N1.0
Characteristics subject to change without notice
PIN DESCRIPTION
Pin #
Name
Function
1
VIN
Charge pump input, connect to battery or supply
2
C1+
Flying capacitor 1 Positive terminal
3
C1-
Flying capacitor 1 Negative terminal
4
EN/SET Device enable (active high) and Dimming Control
5
LEDB
LEDB cathode terminal
6
LEDA
LEDA cathode terminal
7
GND
Ground Reference
8
VOUT
Charge pump output connected to the LED anodes
PAD
PAD
Connect to GND on the PCB
Top view: TDFN 8-lead 2 X 3 mm
PIN FUNCTION
VIN is the supply pin for the charge pump. A small
1
μF ceramic bypass capacitor is required between
the VIN pin and ground near the device. The
operating input voltage range is from 2.7 V to 5.5 V. If
VIN falls below the under-voltage threshold, all LED
channels disable and the device enters shutdown
mode.
EN/SET is the enable and one wire addressable
control logic input for all LED channels. Guaranteed
levels of logic high and logic low are set at 1.4 V and
0.4 V respectively. When EN/SET is initially taken
high, the device becomes enabled and all LED
currents remain at 0 mA. To start LED current, device
should be in PWM mode (See p. 5). To place the
device into zero current mode, the EN/SET pin must
be held low for more than 50 ms.
VOUT is the charge pump output that is connected to
the LED anodes. A small 2.2
μF ceramic bypass
capacitor is required between the VOUT pin and
ground near the device.
GND is the ground reference for the charge pump.
The pin must be connected to the ground plane on
the PCB.
C1+, C1- are connected to each side of the ceramic
flying capacitor C1
LEDA, LEDB provides the internal regulated current
source for each of the LED cathodes. These pins
enter high-impedance zero current state whenever
the device is in shutdown mode.
PAD is the exposed pad underneath the packag e.
For best thermal performance, the pad should be
soldered to the PCB and connected to the ground
plane


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