| Electronic Components Datasheet Search |
|
HSDL-3003 Datasheet(PDF) 13 Page - Agilent(Hewlett-Packard) |
|
|
|||||||||||||||||||||||||||||
HSDL-3003 Datasheet(HTML) 13 Page - Agilent(Hewlett-Packard) |
|
13 / 21 page ![]() 13 Appendix A: SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil Figure 16. Stencil and PCBA. 1.1 Recommended Land Pattern Figure 17. Land pattern. METAL STENCIL FOR SOLDER PASTE PRINTING LAND PATTERN PCBA STENCIL APERTURE SOLDER MASK 0.60 1.25 1.75 1.35 0.475 1.425 2.375 3.325 CL MOUNTING CENTER SHIELD SOLDER PAD 2.05 0.775 0.10 FIDUCIAL |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |