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RK808 Datasheet(PDF) 75 Page - Rockchip Electronics Co., Ltd |
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RK808 Datasheet(HTML) 75 Page - Rockchip Electronics Co., Ltd |
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75 / 75 page ![]() RK808 Power Management System Version 1.0.1 www.rock-chips.com 75 MOLD THICKNESS A2 - 0.55 0.57 MATERIAL THICKNESS A3 - 0.203REF - PACKAGE SIZE D - 7BSC - E - 7BSC - EP SIZE D1 5.39 5.49 5.59 E1 5.39 5.49 5.59 LEAD LENGTH L 0.30 0.4 0.50 LEAD PITCH e 0.35BSC LEAD WIDTH b 0.1 0.15 0.2 LEAD OSITION OFFSET aaa 0.07 LEAD COPLANARITY bbb 0.08 PACKAGE EDGE PROFILE ccc 0.10 MOLD FLATNESS ddd 0.10 EP POSITION OFFSET eee 0.10 fff 0.05 Note: 1. Coplanarity applies to leads, corner leads and die attach pad. 2. Dimension b applies to metalized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension b should not be measure in that radius area. 3. 0.15mm of dimension b is recommended in PCB layout. |
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