8

ISO1430, ISO1432, ISO1450, ISO1452

ISO1410, ISO1412

SLLSF22C – APRIL 2018 – REVISED APRIL 2019

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Product Folder Links: ISO1430 ISO1432 ISO1450 ISO1452 ISO1410 ISO1412

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

8.4 Thermal Information

ISO14xx

UNIT

DW (SOIC)

16 PINS

Junction-to-ambient thermal resistance

67.9

°C/W

Junction-to-case (top) thermal resistance

27.7

°C/W

Junction-to-board thermal resistance

29.4

°C/W

Junction-to-top characterization parameter

12.9

°C/W

Junction-to-board characterization parameter

28.8

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W

8.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO1410_ISO1412

Maximum power dissipation (both sides)

load = 54

Ω ||50pF, Load on R=15pF

Input a 250 kHz 50% duty cycle square

wave to D pin with

556

mW

Maximum power dissipation (side-1)

28

mW

Maximum power dissipation (side-2)

528

mW

ISO1430_ISO1432

Maximum power dissipation (both sides)

load = 54

Ω ||50pF, Load on R=15pF

Input a 6 MHz 50% duty cycle square

wave to D pin with

352

mW

Maximum power dissipation (side-1)

33

mW

Maximum power dissipation (side-2)

319

mW

ISO1450_ISO1452

Maximum power dissipation (both sides)

load = 54

Ω ||50pF, Load on R=15pF

Input a 25 MHz 50% duty cycle square

wave to D pin with

588

mW

Maximum power dissipation (side-1)

49

mW

Maximum power dissipation (side-2)

539

mW