FC8731 datasheet(5/11 Pages) FS

5 / 11 page

Note 1: Absolute Maximum ratings indicate limits beyond which damage may occur. Electrical specifications do not

apply when operating the device outside of its rated operating conditions.

Note 2: All voltages are with respect to the potential at the ground pin.

Note 3: θ JA is measured in the natural convection at TA=25℃ on a high effective thermal conductivity test board (2

layers, 2S0P).

Note 4: θ JC represents the resistance to the heat flows the chip to package top case.

Note 5: Condition does not apply to input voltages below 2.2V since this is the minimum input operating voltage.

Note 6: Dropout voltage is measured by reducing VIN until VOUT drops 100mV from its nominal value at VIN –VOUT = 1V.

Dropout voltage does not apply to the regulator versions with VOUT less than 2.2V.

Note 7: Turn-off time is time measured between the enable input just decreasing below VIL and the output voltage just

decreasing to 10% of its nominal value.

Note 8: Maximum Power dissipation for the device is calculated using the following equations:

J(MAX)

Where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and θ JA is the

junction-to-ambient thermal resistance. E.g. for the SOT-25 package θ JA = 152°C/W, TJ (MAX) = 150°C and

using TA = 25°C, the maximum power dissipation is found to be 0.82W. The derating factor (-1/θ JA) =

-6.6mW/°C, thus below 25°C the power dissipation figure can be increased by 6.6mW per degree, and

similarity decreased by this factor for temperatures above 25°C.

Note 9: Typical Values represent the most likely parametric norm

FC8731

2018. 05. 03

5/11

Revision No : 1

FC8731 Datasheet(PDF) 5 Page - First Silicon Co., Ltd