WeEn Semiconductors

ACT108W-600D

AC Thyristor power switch

ACT108W-600D

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Product data sheet

21 August 2018

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8. Thermal characteristics

Table 5. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance

from junction to solder

point

full cycle with heatsink compound;

Fig. 7

-

-

15

K/W

in free air; printed circuit board

mounted; minimum footprint; Fig. 8

-

156

-

K/W

thermal resistance

from junction to

ambient free air

in free air; printed circuit board

mounted; pad area; Fig. 9

-

70

-

K/W

003aac808

1

10

(K/W)

1

10

P

t

Fig. 7. Transient thermal impedance from junction to solder point as a function of pulse width