SL2S2602 datasheet(41/55 Pages) NXP

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NXP Semiconductors

SL2S2602

ICODE SLIX2

SL2S2602

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Product data sheet

Rev. 4.1 — 25 July 2017

COMPANY PUBLIC

276341

41 / 55

10 Limiting values

Table 82. Limiting values (Wafer)[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Tstg

storage temperature

-55

+125

°C

Ptot

total power dissipation

125

junction temperature

-40

+85

°C

Ii(max)

maximum input current

LA to LB; peak

[3] -

±60

input current

LA to LB; RMS

VESD

electrostatic discharge voltage

Human body model

[4] -

±2

1. Stresses above those listed under Absolute Maximum Ratings may cause permanent

damage to the device. This is a stress rating only and functional operation of the

device at these or any conditions other than those described in the operating

conditions and electrical characteristics sections of this specification is not implied.

2. This product includes circuitry specifically designed for the protection of its internal

devices from the damaging effects of excessive static charge. Nonetheless, it is

suggested that conventional precautions be taken to avoid applying greater than the

rated maxima.

3. The voltage between LA and LB is limited by the on-chip voltage limitation circuitry

(corresponding to parameter II).

4. For ESD measurement, the IC was mounted in a CDIP8 package.

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