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SAMD21J Datasheet(PDF) 55 Page - Microchip Technology |
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SAMD21J Datasheet(HTML) 55 Page - Microchip Technology |
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55 / 59 page  Table 8-29. Device and Package Maximum Weight 6.22 mg Table 8-30. Package Characteristics Moisture Sensitivity Level MSL1 Table 8-31. Package Reference JEDEC Drawing Reference N/A JESD97 Classification e1 8.3 Soldering Profile The following table gives the recommended soldering profile from J-STD-20. Table 8-32. Profile Feature Green Package Average Ramp-up Rate (217°C to peak) 3°C/s max. Preheat Temperature 175°C ±25°C 150-200°C Time Maintained Above 217°C 60-150s Time within 5°C of Actual Peak Temperature 30s Peak Temperature Range 260°C Ramp-down Rate 6°C/s max. Time 25°C to Peak Temperature 8 minutes max. A maximum of three reflow passes is allowed per component. 32-bit ARM-Based Microcontrollers © 2017 Microchip Technology Inc. Datasheet Summary 40001884A-page 55 |
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