TPS746 datasheet(29/45 Pages) TI

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GND PLANE

Cff

COUT

CIN

RPG

Signal via to Pin1

*Pull-up resistor not required for push-pull option

GND PLANE

Cff

COUT

CIN

RPG

Signal via to Pin1

*Pull-up resistor not required for push-pull option

TPS746-Q1

www.ti.com

SBVS358A – JUNE 2018 – REVISED OCTOBER 2019

Product Folder Links: TPS746-Q1

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9 Power Supply Recommendations

The TPS745-Q1 is designed to operate from an input voltage supply range from 1.5 V to 6.0 V. The input voltage

range provides adequate headroom in order for the device to have a regulated output. This input supply must be

well regulated. If the input supply is noisy, additional input capacitors with low ESR may help improve output

noise performance. Connect a low output impedance power supply directly to the IN pin of the TPS746-Q1.

10 Layout

10.1 Layout Guidelines

•

Place input and output capacitors as close to the device as possible.

•

Use copper planes for device connections in order to optimize thermal performance.

•

Place thermal vias around the device to distribute heat.

•

Place a tented thermal via directly beneath the thermal pad of the DRV or DRB package. An untented via can

wick solder or solder paste away from the thermal pad joint during the soldering process, leading to a

compromised solder joint on the thermal pad.

10.2 Layout Examples

Figure 60. Layout Example for the DRV Package

Figure 61. Layout Example for the DRB package

TPS746 Datasheet(PDF) 29 Page - Texas Instruments