F2970 Datasheet

© 2016 Integrated Device Technology, Inc.

3

November 11, 2016

Absolute Maximum Ratings

Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other

conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Symbol

Minimum

Maximum

Units

-0.3

4.0

V

C1, C2 to GND

-0.3

Lower of

V

RF1, RF2, RFC to GND

-0.3

+0.3

V

RF1 or RF2 as an input

(Connected to RFC)

30

dBm

RFC as an input

(Connected to RF1 or RF2)

30

RF1 or RF2 as an input

(Terminated states)

26

Maximum Junction Temperature

140

°C

Storage Temperature Range

-65

150

°C

Lead Temperature (soldering, 10s)

260

°C

ElectroStatic Discharge – HBM

(JEDEC/ESDA JS-001-2012)

2000

(Class 2)

V

ElectroStatic Discharge – CDM

(JEDEC 22-C101F)

1500

(Class C3)

V