6.4 Thermal Information: OPA210

THERMAL METRIC(1)

OPA210

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

135.5

142.6

°C/W

Junction-to-case (top) thermal resistance

73.7

46.9

°C/W

Junction-to-board thermal resistance

61.9

63.5

°C/W

Junction-to-top characterization parameter

19.7

5.3

°C/W

Junction-to-board characterization parameter

54.8

62.8

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermalmetrics, see the Semiconductor and ICPackage Thermal Metrics application

report.

6.5 Thermal Information: OPA2210

THERMAL METRIC(1)

OPA2210

UNIT

D (SOIC)

DGK (VSSOP)

DRG (SON)

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

126.1

132.7

52.1

°C/W

Junction-to-case (top) thermal resistance

65.7

38.5

51.8

°C/W

Junction-to-board thermal resistance

69.5

52.1

24.8

°C/W

Junction-to-top characterization parameter

17.4

2.4

1.1

°C/W

Junction-to-board characterization parameter

68.9

52.8

24.8

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

9.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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OPA210, OPA2210

SBOS924F – SEPTEMBER 2018 – REVISED JANUARY 2021

Copyright © 2021 Texas Instruments Incorporated

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Product Folder Links: OPA210 OPA2210