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TMUX7308F Datasheet(PDF) 4 Page - Texas Instruments

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Part # TMUX7308F
Description  TMUX730xF 짹60-V Fault-Protected, 8:1 and Dual 4:1 Multiplexers with 1.8-V Logic
PDF  34 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TMUX7308F Datasheet(HTML) 4 Page - Texas Instruments

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1
A0
16
A1
2
EN
15
GND
3
VSS
14
VDD
4
S1A
13
S1B
5
S2A
12
S2B
6
S3A
11
S3B
7
S4A
10
S4B
8
DA
9
DB
Not to scale
Figure 5-3. PW Package 16-Pin TSSOP Top View
1
VSS
12
VDD
2
S1A
11
S1B
3
S2A
10
S2B
4
S3A
9
S3B
Not to scale
Thermal
Pad
Figure 5-4. RRP Package 16-Pin WQFN Top View
Table 5-2. Pin Functions: TMUX7309F
PIN
TYPE(1)
DESCRIPTION
NAME
TSSOP
WQFN
A0
1
15
I
Logic control input address 0 (A0).
EN
2
16
I
Active high digital enable (EN) pin. The device is disabled and all switches become high
impedance when the pin is low. When the pin is high, the Ax logic inputs determine individual
switch states.
VSS
3
1
P
Negative power supply. This pin is the most negative power-supply potential. In single-supply
applications, this pin can be connected to ground. For reliable operation, connect a decoupling
capacitor ranging from 0.1 µF to 10 µF between VSS and GND.
S1A
4
2
I/O
Source pin 1A. Can be an input or output.
S2A
5
3
I/O
Source pin 2A. Can be an input or output.
S3A
6
4
I/O
Source pin 3A. Can be an input or output.
S4A
7
5
I/O
Source pin 4A. Can be an input or output.
DA
8
6
I/O
Drain terminal A. Can be an input or output.
DB
9
7
I/O
Drain terminal B. Can be an input or output.
S4B
10
8
I/O
Source pin 4B. Can be an input or output.
S3B
11
9
I/O
Source pin 3B. Can be an input or output.
S2B
12
10
I/O
Source pin 2B. Can be an input or output.
S1B
13
11
I/O
Source pin 1B. Can be an input or output.
VDD
14
12
P
Positive power supply. This pin is the most positive power-supply potential. For reliable
operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and
GND.
GND
15
13
P
Ground (0 V) reference
A1
16
14
I
Logic control input address 1 (A1).
Thermal
Pad
–
–
P
The thermal pad is not connected internally. No requirement to solder this pad. For best
performance it is recommended that the pad be tied to GND or VSS
TMUX7308F, TMUX7309F
SCDS403 – FEBRUARY 2021
www.ti.com
4
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Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: TMUX7308F TMUX7309F



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