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TMUX7308F Datasheet(PDF) 7 Page - Texas Instruments |
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TMUX7308F Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 34 page ![]() 8 Thermal Information THERMAL METRIC(1) TMUX7308F/ TMUX7309F UNIT PW (TSSOP) RRP (QFN) 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance TBD 43.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance TBD 28.8 °C/W RθJB Junction-to-board thermal resistance TBD 17.9 °C/W ΨJT Junction-to-top characterization parameter TBD 0.4 °C/W ΨJB Junction-to-board characterization parameter TBD 17.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance TBD 4.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. www.ti.com TMUX7308F, TMUX7309F SCDS403 – FEBRUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TMUX7308F TMUX7309F |
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