ADGS1408 datasheet(34/34 Pages) AD

34 / 34 page

ADGS1408/ADGS1409

Data Sheet

Rev. 0 | Page 34 of 34

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-VGGD-8.

BOTTOM VIEW

TOP VIEW

4.10

4.00 SQ

3.90

1.00

0.95

0.90

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

0.30

0.25

0.18

0.20 MIN

2.70

2.60 SQ

2.50

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 55. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.95 mm Package Height

(CP-24-17)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADGS1408BCPZ

−40°C to +125°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-17

ADGS1408BCPZ-RL7

−40°C to +125°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-17

ADGS1409BCPZ

−40°C to +125°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-17

ADGS1409BCPZ-RL7

−40°C to +125°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-17

EVAL-ADGS1408SDZ

ADGS1408 Evaluation Board

EVAL-ADGS1409SDZ

ADGS1409 Evaluation Board

1 Z = RoHS Compliant Part.

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D16791-0-6/18(0)

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