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MPC5676R Datasheet(PDF) 43 Page - NXP Semiconductors |
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MPC5676R Datasheet(HTML) 43 Page - NXP Semiconductors |
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43 / 111 page  Electrical Characteristics MPC5676R Microcontroller Data Sheet, Rev. 4 Freescale Semiconductor 43 Figure 17. D_CLKOUT Timing 1 EBI timing specified at V DD = 1.08 V to 1.32 V, VDDE = 3.0 V to 3.6 V, VDD33 and VDDSYN = 3.0 V to 3.6 V, TA =TL to TH, and CL = 30 pF with DSC = 0b10. 2 Speed is the nominal maximum frequency. Max speed is the maximum speed allowed including frequency modulation (FM). 3 Depending on the internal bus speed, set the SIU_ECCR[EBDF] bits correctly not to exceed maximum external bus frequency. The maximum external bus frequency is 66 MHz. 4 Refer to Fast pad timing in Table 29 and Table 30. 5 ALE hold time spec is temperature dependant. 1.0ns spec applies for temperature range -40 to 0 C. 2.0ns spec applies to temperatures > 0 C. This spec has no dependency on SIU_ECCR[EBTS] bit. 1 2 2 3 4 D_CLKOUT VDDE / 2 VOL_F VOH_F |
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