TGA2575

Ka-Band 3 Watt Power Amplifier

Data Sheet: Rev C

3/24/16

- 9 of 11 -

Disclaimer: Subject to change without notice

© 2016 TriQuint Semiconductor, Inc.

Mechanical Information

Unit: millimeters

Thickness: 0.05

Die x, y size tolerance: +/- 0.050

Chip edge to bond pad dimensions are shown to center of pad

Ground is backside of die

Bond Pad

Symbol

Pad Size

1

RF In

0.126 x 0.202

2, 6

Vg

0.101 x 0.101

3, 5

Vd

0.126 x 0.302

4

RF Out

0.126 x 0.202

2.784

0.097

0

2.603

0.109

5.307

5.404

5.295

1

2

3

4

5

6