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AT25DN011 Datasheet(PDF) 39 Page - Dialog Semiconductor |
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AT25DN011 Datasheet(HTML) 39 Page - Dialog Semiconductor |
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39 / 42 page ![]() 38 AT25DN011 DS-25DN011–038H–8/2021 16.2 8MA3 – UDFN TITLE DRAWING NO. GPC REV. Package Drawing Contact: contact@adestotech.com ® 8MA3 YCQ GT 8MA3, 8-pad, 2 x 3 x 0.6 mm Body, 0.5 mm Pitch, 1.6 x 0.2 mm Exposed Pad, Saw Singulated Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN/USON) D E Pin 1 ID TOP VIEW SIDE VIEW A1 A SYMBOL MIN NOM MAX A A1 b D2 E e 0.45 0.00 0.20 1.50 0.40 0.60 0.06 0.30 1.70 0.60 COMMON DIMENSIONS (Unit of Measure = mm) L BOTTOM VIEW Pin #1 Notch (0.20 R) (Option B) Option A Pin #1 Chamfer (C 0.35) 0.45 D2 L 1 2 3 4 b K 5 6 7 8 1. This package conforms to JEDEC reference MO-229, Saw Singulation. 2. . The terminal #1 ID is a Laser-marked Feature. Notes: 2.00 BSC ±0.1 0.50 0.50 BSC 3.00 BSC ±0.1 1.60 e A3 A3 0.150 REF D |
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