ADA4558

Data Sheet

Rev. 0 | Page 6 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VDD12

40 V

LIN

40 V

Reverse Protection

VDD12

AGND to −0.3 V

LIN

−40 V

VREG, VPOS, VNEG, TPOS, TNEG, ISINK,

RREFN

−0.3 V to +6 V

LIN Short-Circuit Duration to LINGND or

VDD12

Indefinite

ESD

Human Body Model (All Pins)

4000 V

LIN and LIN2 Pins

6000 V

Charged Device Model

1000 V

Machine Model

200 V

LIN, LIN2 ESD (IEC 61000-4-2)

>8 kV contact

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +150°C

Junction Temperature Range

−40°C to +165°C

Soldering Profile

IPC/JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit

board (PCB) design and operating environment. Close

attention to PCB thermal design is required.

the junction to case thermal resistance.

Table 3. Thermal Resistance

Package Type

Unit

49

1.42

°C/W

4-layer test board.

ESD CAUTION