Data Sheet

ADA4558

Rev. 0 | Page 7 of 12

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

14

13

12

1

3

4

TNEG

15 ISINK

TPOS

RREFN

11 VREG

DVDD

TESTD

2

DGND

SWDIO

5

SWCLK

NOTES

1. NIC = NOT INTERNALLY CONNECTED. THIS PIN IS NOT INTERNALLY CONNECTED.

CONNECT NIC TO THE GROUND PLANE.

2. CONNECT THE EXPOSED PAD OF THE LFCSP PACKAGE TO THE ANALOG GROUND PLANE.

ENSURE THAT AGND IS CONNECTED TO DGND AND LINGND AT A SINGLE POINT ON THE PCB.

ADA4558

TOP VIEW

(Not to Scale)

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

DVDD

1.8 V Low Dropout (LDO) Digital Supply. Add a 0.1 μF capacitor placed as close to Pin 1 as possible between DVDD

and the DGND plane.

2

DGND

Digital Ground.

3

TESTD

Test Pin. Analog Devices, Inc., uses this pin at the production test. Connect TESTD to the DGND plane in the application.

4

SWDIO

Test Pin. Analog Devices uses this pin at the production test. Connect SWDIO to the DGND plane in the application.

5

SWCLK

Test Pin. Analog Devices uses this pin at the production test. Connect SWCLK to the DGND plane in the application.

6

NIC

Not Internally Connected. This pin is not internally connected. Connect NIC to the ground plane.

7

VNEG

Negative Input. Pin 7 is the negative input to the PGA from the external resistive bridge.

8

TEST1

Test Pin. Analog Devices uses this pin at the production test. Connect TEST1 to the AGND plane in the application.

9

VPOS

Positive Input. Pin 9 is the positive input to the PGA from an external resistive bridge.

10

TEST2

Test Pin. Analog Devices uses this pin at the production test. Connect TEST2 to the AGND plane in the application.

11

VREG

Regulated 4.0 V Output. Pin 11 drives the top of the external bridge. Add a 0.1 μF capacitor between VREG and the

AGND plane, placed as close to the VREG pin as possible.

12

RREFN

Reference Resistor. Pin 12 is the reference resistor for the external temperature sensor sense connection. Connect

Pin 12 to ground when there is no external temperature sensor.

13

TPOS

External Temperature Positive Input. Connect Pin 13 to ground when there is no external temperature sensor.

14

TNEG

External Temperature Sensor Negative Input. Connect Pin 14 to ground when there is no external temperature sensor.

15

ISINK

Current Sink. Pin 15 drives the external temperature sensor. Connect Pin 15 to ground when there is no external

temperature sensor.

16

AGND

Analog Ground.

17

VDD12

Supply. Connect the 12 V battery supply to this pin. Decouple VDD12 with a 1 µF capacitor. A 100 nF capacitor can

be used only when a 1 µF capacitor to ground is placed on the anode of the diode on the module battery supply.

18

LIN2

Not in Use. The LIN2 function is not in use. Connect LIN2 to the LIN pin.

19

LIN

LIN Compliant Interface. All communication to and from the IC is via the LIN pin. Connect a LIN capacitor to ground

on this pin, per the LIN specification.

20

LINGND

Local LIN Ground.

EPAD

Exposed Pad. Connect the exposed pad of the LFCSP to the analog ground plane. Ensure that AGND is connected

to DGND and LINGND at a single point on the PCB.