ADA4558

Data Sheet

Rev. 0 | Page 12 of 12

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.30

0.25

0.18

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD.

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.75

2.60 SQ

2.35

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

1

20

6

10

11

15

16

5

Figure 6. 20-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-20-8)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADA4558WHCPZ-RL

–40°C to +150°C

20-Lead Lead Frame Chip Scale Package [LFCSP]

CP-20-8

ADA4558WHCPZ-R7

–40°C to +150°C

20-Lead Lead Frame Chip Scale Package [LFCSP]

CP-20-8

EVAL-ADA4558EBZ

Evaluation Board

AUTOMOTIVE PRODUCTS

The ADA4558W models are available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in

automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these models.

©2019 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

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