MAX14721 datasheet(2/20 Pages) MAXIM

2 / 20 page

(All voltages referenced to GND.)

IN (Note 1)..........................................................-0.3V to +60.5V

OUT.............................................................. -0.3V to VIN + 0.3V

HVEN (Note 1) ............................................. -0.3V to VIN + 0.3V

GP .....................................max (-0.3V, VIN - 20V) to VIN + 0.3V

UVLO, OVLO...............................-0.3V to min (VIN + 0.3V, 20V)

FLAG, EN, RIPEN, CLTS1, CLTS2.........................-0.3V to +6V

Maximum Current into IN (DC) (Note 2) .................................2A

SETI................................................-0.3V to min(VIN + 0.3V, 6V)

Continuous Power Dissipation (TA = +70°C)

TQFN (derate 31.3mW/ºC above +70°C)..................2500mW

Operating Temperature Range......................... -40°C to +125°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

PACKAGE TYPE: 20 TQFN

Package Code

T2055+3C

Outline Number

21-0140

Land Pattern Number

90-0008

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction to Ambient (θJA)

32°C/W

Junction to Case (θJC)

3°C/W

Note 1: An external pFET or diode is required to achieve negative input protection.

Note 2: DC current-limited by RSETI as well as by thermal design.

For the latest package outline information and land patterns (footprints), go to

www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Package Information

MAX14721/

MAX14722/

MAX14723

High-Accuracy, Adjustable Power Limiter

www.maximintegrated.com

Maxim Integrated │ 2

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to

MAX14721 Datasheet(PDF) 2 Page - Maxim Integrated Products

MAX14721 Datasheet(HTML) 2 Page - Maxim Integrated Products

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Datasheet Download

Link URL