ADM1272 datasheet(11/57 Pages) AD

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Data Sheet

ADM1272

Rev. B | Page 11 of 57

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VCC, SENSE± to GND

−0.3 V to +120 V

VΔSENSE (SENSE+ − SENSE−)

−1 V to +1 V

VOUT to GND

−5 V to +120 V

VCP to GND

−0.3 V to (VOUT + 12 V) or

(VCC + 15 V), whichever is lower

GATE (Internal Supply Only)1 to

GND

(VOUT − 0.3 V) to (VCP + 0.3 V)

DVDT to GND

(VOUT − 0.3 V) to (GATE + 0.3 V)

UVH, UVL, OV, MCB to GND

−0.3 V to +6.5 V

ISTART, ISET, VCAP to GND

−0.3 V to +4 V

ESTART, EFAULT, TEMP+ to GND

−0.3 V to VCAP + 0.3 V

VREG (Internal Supply Only) to

GND

−0.3 V to +5.5 V

FAULT, RESTART to GND

−0.3 V to +20 V

PWGIN, SCL, SDAO, SDAI, ADR0,

ADR1 to GND

−0.3 V to +6.5 V

RND to GND

−0.3 V to VCAP + 0.3 V

ENABLE, GPIO1/ALERT1/CONV,

GPIO2/ALERT2, PWRGD to GND

−0.3 V to +20 V

TEMP− Pin to GND (Internally

Connected to GND)

0 V

Continuous Current into Any Pin

±10 mA

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +105°C

Lead Temperature, Soldering

(10 sec)

300°C

Junction Temperature

125°C

1 The GATE pin has internal clamping circuits to prevent the GATE pin voltage

from exceeding the maximum ratings of a MOSFET with a gate to source

voltage (VGSMAX) = 20 V and internal process limits. Applying a voltage source

to this pin externally may cause irreversible damage.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL CHARACTERISTICS

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 5. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-48-181

Still Air

0.5

°C/W

2 m/sec Air Flow

°C/W

1 The thermal resistance values are based on JEDEC 2S2P test conditions.

ESD CAUTION

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