LTC7862

31

Rev 0

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Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PACKAGE DESCRIPTION

FE20 (CB) TSSOP REV L 0117

0.09 – 0.20

(.0035 – .0079)

0

° – 8°

0.25

REF

RECOMMENDED SOLDER PAD LAYOUT

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

1

3 4 5 6 7 8 9 10

DETAIL A

DETAIL A IS THE PART OF

THE LEAD FRAME FEATURE

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

11

12

14 13

6.40 – 6.60*

(.252 – .260)

3.86

(.152)

2.74

(.108)

20 1918 17 16 15

1.20

(.047)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

2

2.74

(.108)

0.45

±0.05

0.65 BSC

4.50

±0.10

6.60

±0.10

1.05

±0.10

3.86

(.152)

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

6.40

(.252)

BSC

FE Package

20-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663 Rev L)

Exposed Pad Variation CB

DETAIL A

0.60

(.024)

REF

0.28

(.011)

REF