6.4 Thermal Information

THERMAL METRIC(1)

AMC1202

UNIT

DWV (SOIC)

8 PINS

Junction-to-ambient thermal resistance

85.4

°C/W

Junction-to-case (top) thermal resistance

26.8

°C/W

Junction-to-board thermal resistance

43.5

°C/W

Junction-to-top characterization parameter

4.8

°C/W

Junction-to-board characterization parameter

41.2

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

VALUE

UNIT

Maximum power dissipation (both sides)

VDD1 = VDD2 = 5.5 V

99

mW

Maximum power dissipation (high-side)

VDD1 = 3.6 V

31

mW

VDD1 = 5.5 V

54

Maximum power dissipation (low-side)

VDD2 = 3.6 V

26

mW

VDD2 = 5.5 V

45

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AMC1202

SBASAB8 – MAY 2021

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